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Semiconductor Package Substrate 12um copper buildup types

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Semiconductor Package Substrate 12um copper buildup types

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Semiconductor Package Substrate 12um copper buildup types

Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished ...

Product Tags:

HDI IC Package Substrate

      

MEMS IC Package Substrate

      

0.5oz Copper Flipchip Substrate

      
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